Intercept Technology™ in Electronics and Telecommunications

Bell Labs developed the Intercept Technology™ for their own applications and uses, so the natural first place that Intercept was used was in protecting sensitive telecommunication equipment. One of the first applications was for protecting circuit boards – the first million boards protected in Static Intercept® were reviewed and no failures were found due to ESD damage, Corrosion damage or latent defects. Bell Labs had determined that up to 80% of board failures had been due to a combination of ESD and Corrosion, which was resolved by the use of Intercept Technology™ bags. Only Intercept provides effective dual ESD and Corrosion protection with no contamination and no ESD shelf life.

Bell Labs also calculated that the use of Static Intercept® would dramatically reduce their carbon footprint – an estimated 4000% reduction in carbon emissions by switching from traditional non-recyclable ESD packaging that does not provide corrosion (solderability) protection to Static Intercept® bags for their boards.

Key Attributes

  • Withstands extreme temperatures without reducing protection.
  • Offers superiror versatility, available in several styles for sizing.
  • Saves time through optimization of processes.
  • Reduces costs via reusable and recyclable materials.

Recommendations For Electronics / Telecommunications

  • Static Intercept® Films / Bags / Totes / Trays
  • RIBS MVTR / RIBS Ultra Films / Bags
  • AT Technology Clear Anti-Static (A/S) Films / Bags
  • ATCI AT Technology with Corrosion Intercept®